发明名称 |
PAD CONDITIONER HAVING REDUCED FRICTION AND METHOD OF MANUFACTURING THE SAME |
摘要 |
This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same.
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申请公布号 |
US2011250826(A1) |
申请公布日期 |
2011.10.13 |
申请号 |
US201113081981 |
申请日期 |
2011.04.07 |
申请人 |
EHWA DIAMOND IND. CO., LTD. |
发明人 |
YOON SO YOUNG;LEE JOO HAN;LEE JONG JAE |
分类号 |
B24B53/12;B24D3/00;B24D18/00 |
主分类号 |
B24B53/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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