发明名称 MODULE SUBSTRATE, PRODUCTION METHOD FOR MODULE SUBSTRATE, AND TERMINAL CONNECTION BOARD
摘要 Provided is a module substrate, a production method for the module substrate, and a terminal connection board whereby terminals can be reliably connected without shorting between terminal electrodes and a simpler production process can be achieved. A plurality of terminal connection boards (14), which have a plurality of columnar terminal electrodes (142) positioned on one surface or both surfaces of an insulator (141), are mounted on one surface of a collective substrate (1), such that at least a plurality of adjacent module substrates are straddled. The collective substrate (1), with a plurality of terminal connection substrates (14) on one surface and a plurality of electronic components (12) on at least one surface, is divided at positions where the module substrate is to be cut.
申请公布号 WO2011129161(A1) 申请公布日期 2011.10.20
申请号 WO2011JP55028 申请日期 2011.03.04
申请人 MURATA MANUFACTURING CO.,LTD.;YAMAMOTO ISSEI 发明人 YAMAMOTO ISSEI
分类号 H05K1/18;H05K3/00 主分类号 H05K1/18
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