发明名称 |
Method for Fabricating Through Substrate Microchannels |
摘要 |
A method of forming large microchannels in an integrated circuit by etching an enclosed trench into the substrate and later thinning the backside to expose the bottom of the trenches and to remove the material enclosed by the trench to form the large microchannels. A method of simultaneously forming large and small microchannels. A method of forming structures on the backside of the substrate around a microchannel to mate with another device.
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申请公布号 |
US2011256687(A1) |
申请公布日期 |
2011.10.20 |
申请号 |
US20100761085 |
申请日期 |
2010.04.15 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
JACOBSEN STUART MCDOUGALL;BURGESS BYRON NEVILLE |
分类号 |
H01L21/762 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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