发明名称 |
METHOD FOR SUBSTANTIALLY UNIFORM COPPER DEPOSITION ONTO SEMICONDUCTOR WAFER |
摘要 |
The methods practiced in an electrochemical deposition apparatus with two or more electrodes, described in earlier inventions, are disclosed. The methods produce uniform copper films with WFNU less than 2.5% on semiconductor wafers bearing a resistive copper seed layer with a thickness ranging from 50 to 9O0 A in a copper sulfate based electrolyte whose conductivity is between 0.02 to 0.8 S/cm.
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申请公布号 |
US2011259752(A1) |
申请公布日期 |
2011.10.27 |
申请号 |
US200813119125 |
申请日期 |
2008.09.16 |
申请人 |
ACM RESEARCH (SHANGHAI) INC. |
发明人 |
MA YUE;WANG XI;HE CHUAN;WANG HUI |
分类号 |
C25D7/12 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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