ATTACHMENT MATERIAL FOR SEMICONDUCTOR CHIP BONDING, ATTACHMENT FILM FOR SEMICONDUCTOR CHIP BONDING, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is an attachment material for semiconductor chip bonding, whereby manufacturing a highly reliable semiconductor device, controlling such that a fillet shape does not take on a convex shape, is possible. The disclosed attachment material for semiconductor chip bonding has a shear modulus (Gr) as measured with a viscoelasticity measurement device that is greater than or equal to 1*106 Pa at 25 degrees C; a minimum complex viscosity (?*min) up to the melting point of solder as measured by a rheometer that is less than or equal to 5x101 Pa°s; and the complex viscosity (?*(1Hz)) when measured at 140 degrees C, 1 rad distortion, and a frequency of 1Hz is 0.5-4.5 times the complex viscosity (?*(10Hz)) when measured at 140 degrees C, 1 rad distortion, and a frequency of 10Hz.