| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrostatic chuck which is usable over a wide temperature range with reduced warping of a wafer mounting surface during use at a high temperature. <P>SOLUTION: An electrostatic chuck comprises a bipolar electrode for an electrostatic chuck, and an electrode for a heater. When the volume resistivity of a dielectric layer is indicated as ρ1, the volume resistivity between the poles of the bipolar electrode for electrostatic chuck is ρ2, and the volume resistivity between the electrode for the electrostatic chuck and the heater electrode is ρ3, the relationship is ρ1<ρ2<ρ3. It is preferable that the volume resistivity of the dielectric layer gradually decreases from the electrode for the electrostatic chuck towards the wafer mounting surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
