| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor processing method for covering and protecting the edge of a semiconductor wafer without cleaning of the semiconductor wafer edge, and an adhesive tape to be used in the semiconductor processing method. <P>SOLUTION: The semiconductor wafer processing method includes steps of sticking the adhesive tape on the outer peripheral edge of the semiconductor wafer and removing the adhesive tape in a processing step of the semiconductor wafer. The adhesive tape with electrical insulation is used in the semiconductor processing method. The adhesive tape for preventing contamination at the outer peripheral edge of the wafer is used in the semiconductor processing method. <P>COPYRIGHT: (C)2012,JPO&INPIT |
