SUBSTRATE LAMINATING DEVICE, METHOD FOR MANUFACTURING LAMINATED SEMICONDUCTOR DEVICE, AND LAMINATED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve throughput of a substrate laminating device.

SOLUTION: The substrate laminating device is for laminating a plurality of substrates and comprises: a temperature-raising unit to heat up superposed substrates made by laminating the plurality of substrates to a predetermined temperature; and a heat retaining unit to retain the temperature of the superposed substrates at a temperature at which a plurality of substrates of the superposed substrates which were heated up by the temperature-raising unit are thermally connected to each other. The heat retaining unit has a pressing unit to hold a plurality of the superposed substrates in tandem in between and press them.

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