发明名称 |
Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |
摘要 |
A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s). |
申请公布号 |
EP1235272(B1) |
申请公布日期 |
2011.11.16 |
申请号 |
EP20020000961 |
申请日期 |
2002.01.16 |
申请人 |
PANASONIC CORPORATION |
发明人 |
MINAMIO, MASANORI;KAWAI, FUMIHIKO;OHIRO, MASAHIKO;KOICHI, MASANORI;SATOH, YOSHINORI;OGA, AKIRA;FUKUDA, TOSHIYUKI |
分类号 |
H01L21/48;H01L21/56;H01L21/84;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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