| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide means without the occurrence of a weld failure mode at a junction place when performing wiring connection of a semiconductor device by welding. <P>SOLUTION: A semiconductor device comprises packages 1 in which a semiconductor element is sealed, and a case 3 in which the packages 1 are inserted to form an assembly. Each package 1 comprises terminals 2 extending from the side of the package to the upper direction. The case 3 comprises bus bars 4 that connect the terminals 2 extending to the upper direction from the sides. The terminals 2 extend from the sides of the package 1 to the horizontal direction and are guided toward the upper direction with a shallower angle than the angle of bending in the approximately perpendicular direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
