发明名称 Method of manufacturing glass substrate and method of manufacturing electronic components
摘要 Disclosed is a method of manufacturing a glass substrate with through electrodes, the method including: a wire stretching process in which a plurality of conductive wires are stretched in parallel between upper and lower bases; a wire burying process in which a plurality of the wires between the bases are buried by glass; an ingot formation process in which a glass ingot having the buried wires is formed by cooling the glass; a slicing process in which a glass panel is formed by slicing the glass ingot; and a polishing process in which a plurality of the wires are exposed on front and rear surfaces of the glass panel to provide the through electrodes.
申请公布号 US2012006061(A1) 申请公布日期 2012.01.12
申请号 US201113135498 申请日期 2011.07.07
申请人 TERAO EIJI 发明人 TERAO EIJI
分类号 C03C27/00;C03B23/20 主分类号 C03C27/00
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