| 摘要 |
According to one embodiment, a camera module is disclosed. The module includes a semiconductor substrate having a first main surface and a second main surface facing the first main surface. An imaging region is provided on the first main surface. A penetrative electrode penetrates through the semiconductor substrate between the first main surface and the second main surface. An adhesive layer is provided on the first main surface, the adhesive layer being located outside the imaging region. And a lens member is directly bonded to the adhesive layer, the lens member seals the imaging region and houses an imaging lens therein. |
