| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low melting point glass composition which does not virtually contain PbO and is used as a sealing material for electronic substrates. <P>SOLUTION: The low melting point glass composition includes by mass% 0-8 SiO<SB POS="POST">2</SB>, 2-12 B<SB POS="POST">2</SB>O<SB POS="POST">3</SB>, 2-7 ZnO, 0.5-3 RO(MgO+CaO+SrO+BaO), 0.5-5 CuO, 80-90 Bi<SB POS="POST">2</SB>O<SB POS="POST">3</SB>, 0.1-3 Fe<SB POS="POST">2</SB>O<SB POS="POST">3</SB>, and 0.1-3 Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>. A conductive paste material using the composition is presented. <P>COPYRIGHT: (C)2012,JPO&INPIT |
