| 摘要 |
<P>PROBLEM TO BE SOLVED: To shorten a time required to form an underfill. <P>SOLUTION: A semiconductor chip 1 is mounted on a mounting face of a wiring board 2 so as to form a gap 5 between the semiconductor chip and the mounting face. Resin 7 is supplied near the gap by resin supply means 6, the supplied resin is filled at least in the gap by a capillary force. The resin supply means comprises a liquid storage part 6a and a pipe part 6b. A total amount of the resin required to fill at least the gap is supplied to the liquid storage part of the resin supply resin means at once, and an opening 6c of the pipe part is positioned near the gap. The resin is emitted from the opening of the pipe part, and the emitted resin is filled in the gap by a capillary force. When an amount of resin filled in the gap 5 by the capillary force per unit time is designated as Q1 and an amount of resin supplied from the resin supply means by a gravity action per unit time is designated as Q2, the resin is continuously emitted to satisfy the relationship, Q1≥Q2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
