发明名称 SOLID STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To achieve higher sensitivity without increasing a smear and a chip area. <P>SOLUTION: A thin film region L5a where a film thickness is reduced is provided at an end in the horizontal direction of a charge transfer electrode 5, and a light shielding film 7 is formed, not on a side face of the thin film region L5a, but on the charge transfer electrode 5. Thereby, a distance between the light shielding film 7 and a semiconductor substrate 1 can be reduced, while securing an opening width L6 on a photodiode 2. Accordingly, higher sensitivity can be achieved without increasing a smear and a chip area. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012015133(A) 申请公布日期 2012.01.19
申请号 JP20100147010 申请日期 2010.06.29
申请人 PANASONIC CORP 发明人 HENMI TAKESHI
分类号 H01L27/148;H01L27/14 主分类号 H01L27/148
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