发明名称 SHOT MATERIAL PROJECTION DEVICE AND SHOT MATERIAL PROJECTION STATE DETECTION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To improve detection accuracy of the projection state of a shot material on a workpiece while securing a finish state of the workpiece. <P>SOLUTION: The shot material projection device 10 includes a projection unit 16 which projects the shot material to the workpiece 12 so that the workpiece 12 is subjected to shot blast treatment or shot peening treatment, and an elastic wave detection sensor 26 directly installed on an axial end surface 34A of the workpiece 12. As the elastic wave detection sensor 26 is directly installed on the workpiece 12, an elastic wave generated on the workpiece 12 can be directly detected by the elastic wave detection sensor 26. Therefore, detection accuracy of the elastic wave, and therefore the detection accuracy of the projection state of the shot material 30 to the workpiece 12 can be improved. In addition, an installation part of the elastic wave detection sensor 26 on the workpiece 12 is the axial end surface 34A of the workpiece 12. Thereby, inhibition of projection of the shot material 30 by the elastic wave detection sensor 26 is prevented, and the finish state of the workpiece 12 is secured. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012016764(A) 申请公布日期 2012.01.26
申请号 JP20100154235 申请日期 2010.07.06
申请人 SINTOKOGIO LTD 发明人 YAMAMOTO KAZUTOSHI
分类号 B24C1/10 主分类号 B24C1/10
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