| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputtering apparatus for performing sputtering by a magnetron sputtering method in which the surface on a film formation side of a treatment substrate and a target plate are opposed to each other in parallel, which can solve a conventional problem that a substance dispersed from the target plate adheres to a non-erosion part of the target plate, and accumulates there, causing a foreign matter adhesion to the treatment substrate when the adhered substance is peeled off, which leads to a foreign matter defect, a PH defect, etc. to the treatment substrate. <P>SOLUTION: The target plate 10 is used for sputtering treatment in a state that it is held along a backing plate 12 and has an area which serves as an erosion part in its central section, and an area which serves as a non-erosion part along the entire outside circumference of the area which serves as an erosion part. The surface of at least part of the area which serves as a non-erosion part or part of the area which serves as an erosion part and at least part of the area which serves as a non-erosion part is roughened. <P>COPYRIGHT: (C)2012,JPO&INPIT |
