| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe card in which each contact probe on a probe substrate is electrically connected with wiring on a wiring board and a number of circuit elements can be disposed. <P>SOLUTION: In a probe card where a probe substrate 3 is disposed on a sub substrate 2 and the sub substrate 2 and the probe substrate 3 are electrically connected, electric plating background films 17, 18 formed on the probe substrate 3 are separated from each other, a bonding electrode 12 is formed on the background film 17, and a contact probe 11 is formed on the background film 18. The bonding electrode 12 is conducted with the contact probe 11 via a resistance film 14 and is also conducted with wiring on the sub substrate 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
