THREE-DIMENSIONAL SUBSTRATE MANUFACTURING METHOD AND THREE-DIMENSIONAL SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a circuit substrate capable of ensuring electrical conduction of the surface and rear face of the substrate.

SOLUTION: A circuit substrate manufacturing method of the present invention includes: a step of preparing an insulating substrate 10 having a recessed part 11 on a surface 10A; a step of forming a through hole H in the recessed part on the surface of the insulating substrate 10; a step of filling the through hole H with a conductive paste 30; and a step of plating the surface of the insulating substrate 10 filled with the conductive paste 30 using the conductive paste 30 as a ground for plating. This method makes the surface 10A and rear face 10B of the insulating substrate 10 conductive.

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