| 摘要 |
<P>PROBLEM TO BE SOLVED: To exfoliate a material layer from a substrate without generating a crack in the material layer formed on the substrate. <P>SOLUTION: In order to exfoliate the material layer from the substrate in the interface of the substrate 1 and the material layer 2, to a work 3 in which the material layer 2 is formed on the substrate 1, through the substrate 1, a pulse laser light is irradiated so that adjacent each irradiation region is overlapped in the work 3, while changing the irradiation region to the work 3 every second. The irradiation region of the pulse laser light to the work is set so that when the area of the irradiation region is made to be S (mm<SP POS="POST">2</SP>), the circumference length of the irradiation region to be L (mm), the relation S/L≤0.125 is satisfied. Thereby, it is possible to exfoliate securely the material layer from the substrate without generating a crack in the material layer formed on the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
