发明名称 |
FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION |
摘要 |
A flip chip package includes a substrate having a die attach surface; and a die mounted on the die attach surface with an active surface of the die facing the substrate, wherein the die is interconnected to the substrate via a plurality of copper pillar bumps on the active surface, wherein at least one of the plurality of copper pillar bumps has a bump width that is substantially equal to or smaller than a line width of a trace on the die attach surface of the substrate.
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申请公布号 |
US2012032322(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201113110932 |
申请日期 |
2011.05.19 |
申请人 |
LIN TZU-HUNG;GREGORICH THOMAS MATTHEW |
发明人 |
LIN TZU-HUNG;GREGORICH THOMAS MATTHEW |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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