发明名称 |
SENSOR MODULE |
摘要 |
A sensor module includes a substrate system which has multiple substrates situated one on top of the other and connected in each case via a wafer bond connection. The substrate system includes at least one first sensor substrate and at least one second sensor substrate, the first sensor substrate having a first sensor structure and the second sensor substrate having a second sensor structure. The first and second sensor structures are designed for detecting different characteristics. At least the first sensor structure includes a micromechanical functional structure. Moreover, a method for manufacturing such a sensor module is disclosed.
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申请公布号 |
US2012032283(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201113206024 |
申请日期 |
2011.08.09 |
申请人 |
FREY JENS;WEBER HERIBERT;GRAF ECKHARD |
发明人 |
FREY JENS;WEBER HERIBERT;GRAF ECKHARD |
分类号 |
H01L29/84;H01L21/02;H01L29/66;H01L29/82;H01L31/09 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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