发明名称 |
Method of manufacturing a multilayered printed circuit board |
摘要 |
A multilayered printed circuit board comprising: a substrate (330) on which a conductive circuit (334) is formed; an interlayer insulating resin layer (350) formed on the conductive circuit (334); an opening (348) for forming a via hole (360) formed in the interlayer insulating resin layer (350); and another conductive circuit (358) including a via hole (360) and formed on the interlayer insulating resin layer (350), wherein
the surface of the conductive circuit (334) is subjected to a coarsening process using etching solution containing cupric complex and organic acid, and
stripe pits and projections are formed on the inner wall of the opening (348) for forming the via hole (360). |
申请公布号 |
EP1843650(B1) |
申请公布日期 |
2012.03.07 |
申请号 |
EP20070013524 |
申请日期 |
1999.07.30 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
HIROSE, NAOHIRO;NODA, KOUTA;SEGAWA, HIROSHI;EN, HONJIN;TSUKADA, KIYOTAKA;ISHIDA, NAOTO;ASANO, KOUJI;SHOUDA, ATSUSHI |
分类号 |
H05K3/46;B23K26/38;H05K1/02;H05K3/00;H05K3/10;H05K3/28;H05K3/38;H05K3/42 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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