| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for easily mounting communication units on a mounting substrate even when they are of various sizes. <P>SOLUTION: A motherboard 100 is a substrate on which either a first communication unit 10-1 or a second communication unit 10-2 having a mounting area different from that of the first communication unit 10-1 is selectively mounted. The motherboard 100 comprises: a solder pad 101 to which a side-through electrode 13-1 provided on a lateral face of the first communication unit 10-1 is connected; and a solder pad 102 to which a side-through electrode 13-2 provided on a lateral face of the second communication unit 10-2 is connected. A solder pad 103 on the motherboard 100 has a shape formed by overlaying the solder pad 101 and the solder pad 102 on top of one another. The solder pad 102 is composed of at least part of the solder pad 101. <P>COPYRIGHT: (C)2012,JPO&INPIT |
