| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe assembly which is capable of dealing with pads of narrow pitches and is low-priced. <P>SOLUTION: The present invention relates to a probe assembly having: a vertical probe which is obtained by etching a metal foil and brought into contact with a semiconductor chip electrode to be inspected; a thin-plate probe having an output terminal which is protruded from a side opposite to the vertical probe and brought into contact with a wiring board, and an opening part fitted with a supporting rod in which a part of the cross-sectional shape thereof is approximately rectangular; a first guide groove that is the supporting rod for guiding the opening part; a second guide groove for guiding the vertical probe; and a third guide groove for guiding the output terminal. <P>COPYRIGHT: (C)2012,JPO&INPIT |
