| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a prepreg having a large retaining amount of a resin composition, a low dielectric constant, low dielectric loss tangent, and excellent moldability, further to provide a printed wiring board and a laminated board produced by using the prepreg, and further to provide a semiconductor device produced by using the printed wiring board. <P>SOLUTION: Varnish is obtained when a thermosetting resin composition containing a filler at the rate of 60-85 mass% is contained in a solvent. The prepreg is obtained by removing the solvent after the varnish is retained in glass cloth. The varnish has gelling time at 150°C of 15 minutes or more and gelling time at 180°C of 3.0-7.0 minutes measured according to JIS C 6521. <P>COPYRIGHT: (C)2012,JPO&INPIT |
