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发明名称
可携式电子装置框架
摘要
一种可携式电子装置框架,系包括一供可携式电子装置设置于内的框体,该框体侧边的固定座上设置固定孔,用以于一连接件结合于该固定孔上时,使框体及设置于框体内的可携式电子装置可固定于该连接件上,并随着该连接件移动。
申请公布号
TWM426704
申请公布日期
2012.04.11
申请号
TW100220992
申请日期
2011.11.07
申请人
大阪京实业股份有限公司
发明人
刘耕源
分类号
F16M13/02
主分类号
F16M13/02
代理机构
代理人
潘海涛 台北市松山区复兴北路69号3楼;袁铁生 台北市松山区复兴北路69号3楼
主权项
地址
新北市三重区重新路5段609巷6号8楼之2 TW
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