SEMICONDUCTOR DEVICE, BACK CONTACT SOLAR CELL WITH WIRING BOARD, SOLAR CELL MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Disclosed is a semiconductor device wherein: a first insulating adhesive material (22) is arranged between a surface region of a semiconductor substrate (1) between electrodes (6, 7) that have different polarities and a surface region of an insulating base (11) between adjacent wiring lines (12, 13); and a second insulating adhesive material (23) is arranged between the first insulating adhesive material (22) and a conductive adhesive material (21). The first insulating adhesive material (22) has such properties that the first insulating adhesive material (22) goes into a first cured state, then goes into a softened state, and finally goes into a second cured state; and the semiconductor device is manufactured by keeping the viscosity of the first insulating adhesive material (22) higher than the viscosity of the second insulating adhesive material (23) until the first insulating adhesive material (22) comes into the second cured state. Also disclosed are: a back contact solar cell with a wiring board; a solar cell module; and a method for manufacturing a semiconductor device.