LAMINATE AND METHOD FOR SEPARATING THE SAME

摘要

PURPOSE: A laminate and a separating method are provided to reduce damage risk of a substrate due to transmitted light by suppressing the transmitted light. CONSTITUTION: An adhesive(13) is spin-spread on a semiconductor wafer(11). A compound(15) with an infrared absorptive property is spin-spread on one surface of a support plate(12). A support plate is separated from the semiconductor wafer. An adhesive layer(14) is removed from the semiconductor wafer by spraying solvents to the adhesive layer. A separation layer is broken by lifting the support plate through an external force.