| 摘要 |
<P>PROBLEM TO BE SOLVED: To cool respective semiconductor elements when a temperature difference occurs between the semiconductor elements attached to respective sides of the heat receiving block of a heat pipe type cooler. <P>SOLUTION: The heat pipe type cooler 1 comprises a heat receiving block 2 provided with first and second element mounting surfaces 2a, 2b for mounting semiconductor elements, and a plurality of heat pipes 3 attached to a surface of the heat receiving block 2 located between the first and second element mounting surfaces 2a, 2b. The heat pipes 3 are arranged while being separated to the first element mounting surface 2a sid, and the second element mounting surface 2b side. Cooling fins 44 are fixed integrally in common to the first and second heat pipe arrays 3a, 3b, and a vent hole 5 is formed between the first and second heat pipe arrays 3a, 3b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
