发明名称 METHOD FOR MANUFACTURING HEAT-DISSIPATING SUBSTRATE
摘要 PURPOSE: A method for manufacturing a heat radiation substrate is provided to simplify process by welding a substrate and a heat radiation module through ion junction and to obtain junction uniformity through the ion junction. CONSTITUTION: An insulating layer(20) is formed by anodizing the surface of a metal core(10). The metal core is a base for forming a heat radiation substrate. A heat radiation module(30) formed into metal is attached to one side of the insulating layer. The heat radiation module and the metal core are ion-welded. The heat radiation module and the metal core are same material. A metal layer is formed on the metal core. A circuit pattern is formed on the metal layer.
申请公布号 KR20120066435(A) 申请公布日期 2012.06.22
申请号 KR20100127784 申请日期 2010.12.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, JI HYUN;CHOI, SEOG MOON;LEE, YOUNG KI
分类号 H05K7/20;H05K1/02 主分类号 H05K7/20
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