MULTI-LEVEL INTEGRATED CIRCUIT, DEVICE AND METHOD FOR MODELING MULTI-LEVEL INTEGRATED CIRCUITS

摘要

A multi-level integrated circuit comprising a superposition of a first stack and a second stack of layers, and including: a first row of electronic devices produced in the first stack, extending parallel to a first direction and fitting into a first volume with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H1; a second row of electronic devices produced in the second stack, extending parallel to the first direction and fitting into a second volume with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H2