摘要 |
<p>PURPOSE: A storage media, and a coating method and apparatus are provided to rapidly process a substrate of a following lot by sucking air in a nozzle for a preceding lot and forming a bottom air layer within the nozzle. CONSTITUTION: A resist discharge nozzle(N2) for a preceding lot and a resist discharge nozzle(N1) for a following lot move an interval between coating processors(1a, 1b) and a bus. A thinner layer is formed at the tip-end portion of the resist discharge nozzle for the preceding lot. A resist liquid(RA) is provided to the last wafer(WA25) of the preceding lot from the resist discharge nozzle. Air is sucked in the resist discharge nozzle for the preceding lot and a first air layer is formed within the resist discharge nozzle for the preceding lot. The air is sucked in the resist discharge nozzle for the following lot and a second air layer is formed within the resist discharge nozzle for the following lot.</p> |