发明名称 |
POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE INCLUDING PHOTOSENSITIVE RESIN LAYER |
摘要 |
<p>PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film using the same, and a semiconductor device including the photo-sensitive resin film are provided to improve sensitivity and resolution. CONSTITUTION: A positive type photo-sensitive resin composition includes a polybenzoxazole precursor with a repeating unit in the form of random copolymer, a photo-sensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The repeating unit is represented by chemical formula 1. In chemical formula 1, X1 is derived from a diamine compound represented by chemical formula 30; X2 is an aromatic organic group or a tetravalent to hexavalent aliphatic organic group; Y1 and Y2 are respectively aromatic organic groups or divalent to hexavalent aliphatic organic groups; m and n are molar ratios, the sum of m and n is 100 mol%; m is 1 to 99mol%; and n is 1 to 99mol%.</p> |
申请公布号 |
KR20120074810(A) |
申请公布日期 |
2012.07.06 |
申请号 |
KR20100136757 |
申请日期 |
2010.12.28 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
CHO, HYUN YONG;LEE, JONG HWA;IM, MI RA;CHUNG, MIN KOOK;JEONG, JI YOUNG;CHA, MYOUNG HWAN;KIM, JUNG HYUN;CHEON, HWAN SUNG |
分类号 |
G03F7/039;G03F7/016;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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