发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE INCLUDING PHOTOSENSITIVE RESIN LAYER
摘要 <p>PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film using the same, and a semiconductor device including the photo-sensitive resin film are provided to improve sensitivity and resolution. CONSTITUTION: A positive type photo-sensitive resin composition includes a polybenzoxazole precursor with a repeating unit in the form of random copolymer, a photo-sensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The repeating unit is represented by chemical formula 1. In chemical formula 1, X1 is derived from a diamine compound represented by chemical formula 30; X2 is an aromatic organic group or a tetravalent to hexavalent aliphatic organic group; Y1 and Y2 are respectively aromatic organic groups or divalent to hexavalent aliphatic organic groups; m and n are molar ratios, the sum of m and n is 100 mol%; m is 1 to 99mol%; and n is 1 to 99mol%.</p>
申请公布号 KR20120074810(A) 申请公布日期 2012.07.06
申请号 KR20100136757 申请日期 2010.12.28
申请人 CHEIL INDUSTRIES INC. 发明人 CHO, HYUN YONG;LEE, JONG HWA;IM, MI RA;CHUNG, MIN KOOK;JEONG, JI YOUNG;CHA, MYOUNG HWAN;KIM, JUNG HYUN;CHEON, HWAN SUNG
分类号 G03F7/039;G03F7/016;H01L21/027 主分类号 G03F7/039
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