Method for encapsulation of micro-component e.g. micro-electromechanical system type sensor, involves realizing portion of electrically conductive material electrically connected to electrical contact plate, in connection hole

摘要

The method involves realizing a thick encapsulation layer (110), a connection hole and a liberation hole through one of the faces (101) of a substrate (102), where the connection hole is aligned partially with an electrical contact plate (104) and the liberation hole is opened at the level of a portion of a sacrificial material. The portion of the sacrificial material is suppressed through the liberation hole. A portion of an electrically conductive material (122) electrically connected to the electrical contact plate is realized in the connection hole. The thick encapsulation layer is realized by depositing a polymer resin.