发明名称 SUBTRATE TRANSFERRING UNIT, SUBSTRATE PROCESSING APPARATUS HAVING THE SAME AND SUBTRATE TRANSFER METHOD
摘要 PURPOSE: A substrate chucking unit, a substrate processing apparatus including the same, and a substrate feeding method are provided to easily stick a substrate to a sticky chuck by using a vacuum absorption member as an adhesive member. CONSTITUTION: A carrier(200) moves while chucking a substrate. The carrier comprises a body of a flat plate shape and a sticky chuck(220) installed at one side of the body. A first penetration hole is formed on the body of the carrier. A second penetration hole is formed on the sticky chuck. The sticky chuck chucks the substrate by using adhesive force. A chucking module ascends and descends while adsorbing the substrate. The chucking module comprises a lift bar(410) and an adhesive member. The lift bar separates the substrate from the sticky chuck.
申请公布号 KR20120075314(A) 申请公布日期 2012.07.06
申请号 KR20110022042 申请日期 2011.03.11
申请人 AP SYSTEMS INC. 发明人 YOU, JOUNG PIL;YUN, CHEONG RYONG;CHO, IK SEONG
分类号 H01L21/673;B65G49/06;H01L21/68;H01L33/00 主分类号 H01L21/673
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