| 摘要 |
A high-speed signal transmission board includes a first board part including a first ground pattern, a first insulating layer formed on a first surface and a second surface of the first ground pattern, and a first electrically conductive pattern formed on a surface of the first insulating layer; a second board part including a second ground pattern, a second insulating layer formed on a first surface and a second surface of the second ground pattern, and a second electrically conductive pattern formed on a surface of the second insulating layer; and a connecting part connecting the first electrically conductive pattern of the first board part and the second electrically conductive pattern of the second board part with the first board part and the second board part facing each other.
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