FOLDED STACKED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A folded stacked package and a manufacturing method thereof are provided to omit a plated through hole by arranging a passive device right on a wire circuit which is formed in the embedding of an active element. CONSTITUTION: A flexible substrate(120) includes a first device mounting region and a second device mounting region. The first device mounting region and the second device mounting region are connected to a folding part. A wire(142) is formed on a flexible substrate. A first device is embedded within at least one device mounting region of the first and second device mounting regions. One or more of a plurality of second devices are respectively loaded on one side of the first and second device mounting region.