| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, capable of suppressing a short circuit caused by migration and increasing bump arrangement density while maintaining a margin against displacement of a bump or lead wiring. <P>SOLUTION: The semiconductor device comprises: a plurality of electronic devices 4; a plurality of bumps 3; and lead wiring 5 for connecting electronic devices 4 and bumps 3. The bumps 3 are constituted of first bumps 3 and second bumps 3. The first bumps 3 and the second bumps 3 are formed zigzag in a direction in which the electronic devices 4 are arranged. <P>COPYRIGHT: (C)2012,JPO&INPIT |
