发明名称 SOLID STATE IMAGE PICKUP DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid state image pickup device which inhibits deterioration in image quality. <P>SOLUTION: A solid state image pickup device comprises: a photodiode 131 including an upper element isolation layer 50A, a lower element isolation impurity layer 51A provided between a rear face and the upper element isolation layer 50A and an impurity layer 21; a floating diffusion 39; and a transistor 132 arranged between the photodiode 131 and the floating diffusion 39. A side face of the lower element isolation impurity layer 51A, which faces the transistor 132 across the impurity layer 21 in a horizontal direction with respect to a surface of a semiconductor substrate 10, protrudes more to the transistor 132 side than a side face of the upper element isolation layer 50A. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012164768(A) 申请公布日期 2012.08.30
申请号 JP20110023020 申请日期 2011.02.04
申请人 TOSHIBA CORP 发明人 FURUYA SHOGO;YAMASHITA HIROSHI;YAMAGUCHI TETSUYA
分类号 H01L27/146;H01L27/14;H04N5/369;H04N5/374 主分类号 H01L27/146
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