发明名称 |
TRANSMISSION CONTROL DEVICE AND ELECTRONIC CIRCUIT DEVICE |
摘要 |
It is difficult to dissipate heat generated from a bare chip. In addition, if a bare chip is covered with a sealing resin in such a manner that a heat sink is exposed so as to facilitate heat dissipation, problems such as separation and cracking occur. An electronic circuit device comprises: an electronic circuit assembly for controlling a car transmission and a car brake; a base for fixing the electronic circuit assembly; and a lead terminal for electrically connecting the electronic circuit assembly, wherein the electronic circuit assembly, the base, and the lead terminal are sealed with a mold resin. The electronic circuit device has a heat dissipation structure characterized in that an opening is formed under a heat-emission circuit device (bare chip) through a circuit board and the base and both sides of a heat-emission device are thermally connected to a sealing resin. |
申请公布号 |
WO2012117899(A1) |
申请公布日期 |
2012.09.07 |
申请号 |
WO2012JP54162 |
申请日期 |
2012.02.21 |
申请人 |
HITACHI AUTOMOTIVE SYSTEMS, LTD.;KANNO KIYOTAKA;ODAKURA YASUNORI |
发明人 |
KANNO KIYOTAKA;ODAKURA YASUNORI |
分类号 |
H01L23/34;F16H61/00;H01L21/56;H01L25/07;H01L25/18 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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