| 摘要 |
<p>[Problem] To establish the processes carried out before and after buffer layer deposition in a photoelectric converter manufacturing method using a flexible substrate. [Solution] The surface of a photoelectric conversion semiconductor layer of a substrate (A) is immersed in a surface treatment solution (24), and after being surface treated the substrate (A) is rinsed, and then the water is removed. The substrate (A) is adhered to a drum (3) in a manner such that the photoelectric conversion semiconductor layer (30) forms the surface, and with the section in which the end of the substrate (A) and the substrate of the drum (3) are not adhered overlapped by a protection member (6) and protected from a CBD reaction solution (4), part of the substrate (A) is immersed in the CBD reaction solution (4) by immersing part of the drum (3) in the CBD reaction solution (4), a buffer layer (40) is deposited on the photoelectric conversion semiconductor layer (30), and then the substrate (A) is further rinsed and the rinsing solution is removed.</p> |
