| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which has a novel photosensitive mechanism different from the conventional positive resist material, can obtain excellent sensitivity and resolution in great film thickness and can be used as a positive resist material, and to provide a photosensitive element using the resin composition, a method for forming a resist pattern and a method for manufacturing a print circuit board. <P>SOLUTION: A resin composition contains a high molecular compound having a trithiocarbonate structure and a compound for generating radicals by an actinic ray. <P>COPYRIGHT: (C)2012,JPO&INPIT |
