METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT IN MULTI-CHAMBER SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor element using a multi-chamber system having etching equipment for semiconductor element manufacturing, which has advantages such as higher wafer transfer speed by disposing multiple process chambers serially in multiple layers.

SOLUTION: The method includes: transferring a wafer from a cassette stage to a load lock chamber through a rectangular wafer transfer chamber of atmospheric pressure environment; forming vacuum pressure in the load lock chamber; transferring the wafer from the load lock chamber to the process chamber; and processing the wafer under vacuum in the process chamber. The distance between sidewalls that are farthest from the process chambers disposed apart from each other in a direction parallel to an extension direction of the long side of the cassette stage is less than or equal to the long side of the cassette stage.

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