发明名称 |
Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip |
摘要 |
The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region. |
申请公布号 |
US8278151(B2) |
申请公布日期 |
2012.10.02 |
申请号 |
US20100969959 |
申请日期 |
2010.12.16 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MURATA SHUHEI;MATSUMURA TAKESHI;MIZUNO KOJI;ASAI FUMITERU |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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