| 摘要 |
<P>PROBLEM TO BE SOLVED: To wire a first semiconductor integrated circuit and a second semiconductor integrated circuit without using a via while the first semiconductor integrated circuit has a plurality of pad rows, when a semiconductor device is formed by mounting the first semiconductor integrated circuit and the second semiconductor integrated circuit on one substrate by a flip chip technique. <P>SOLUTION: A first semiconductor integrated circuit 32 and a second semiconductor integrated circuit 33 are arranged on a substrate 31. The first semiconductor integrated circuit 32 includes an outer pad row 34R extending in a side direction. Further, the first semiconductor integrated circuit 32 includes an inner pad row 35 inside the outer pad row 34R, which extends in parallel with the outer pad row 34R. A pad row 34 Ra of a portion of the outer pad row 34R is facing the inner pad row 35 and is electrically connected with pads 33a of the second semiconductor integrated circuit 33, respectively, by metal wiring lines 36 arranged on the substrate 31. <P>COPYRIGHT: (C)2013,JPO&INPIT |
