| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of reworking a semiconductor package by which a thermal stress caused by reflow at the time when a semiconductor package is reworked to a mother board is not communicated to the mother board directly. <P>SOLUTION: A semi-cured resin flat plate 4 formed of an anisotropic conductive material is intervened between a rework component 1 and a mother board 2. In the resin flat plate 4, holes 4a are opened at positions corresponding to respective ball electrodes 1a of the rework component 1 and filled with a conductive agent 3. The resin flat plate 4 has a thermosetting property and is adhered to the rework component 1 and the mother board 2 at the reworking. In addition, the conductive agent 3 filled in the holes 4a of the resin flat plate 4 electrically connects the ball electrodes 1a of the rework component 1 with lands 2a of the mother board 2. Further, the ball electrodes 1a of the rework component 1 and the lands 2a of the mother board 2 are soldered with each other by a solder paste 5 applied after cutting of a removed semiconductor component, and an underfill resin 6 is filled in a gap between the mother board 2 and the resin flat plate 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
