发明名称 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED WIRING BOARD, AND NAPHTHOL RESIN
摘要 <P>PROBLEM TO BE SOLVED: To provide a naphthol resin having slightly-changed heat resistance after subjected to a thermal history and exhibiting low thermal expandability, and further realizing excellent solvent solubility. <P>SOLUTION: The naphthol resin contains 15-35% of a trimer, which is a polycondensate of an &alpha;-naphthol compound, a &beta;-naphthol compound and formaldehyde and is shown by formula (1) (wherein R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>are each a hydrogen atom, a 1C-4C hydrocarbon group or a 1C-4C alkoxy group independently), and 1-25% of a dimer of the polycondensate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012201798(A) 申请公布日期 2012.10.22
申请号 JP20110067730 申请日期 2011.03.25
申请人 DIC CORP 发明人 SATO YASUSHI
分类号 C08G8/24;C08G59/62;C08K5/13;C08L61/12;C08L63/00;H05K1/03 主分类号 C08G8/24
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