| 发明名称 |
Doping Minor Elements into Metal Bumps |
| 摘要 |
A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump.
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| 申请公布号 |
US2012286423(A1) |
申请公布日期 |
2012.11.15 |
| 申请号 |
US201213556016 |
申请日期 |
2012.07.23 |
| 申请人 |
CHENG MING-DA;HO MING-CHE;LIU CHUNG-SHI;HWANG CHIEN LING;LIN CHENG-CHUNG;TSAI HUI-JUNG;LIM ZHENG-YI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHENG MING-DA;HO MING-CHE;LIU CHUNG-SHI;HWANG CHIEN LING;LIN CHENG-CHUNG;TSAI HUI-JUNG;LIM ZHENG-YI |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
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