| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sealing resin composition which can have excellent flame retardancy without use of a halogen-based flame retardant and an antimony compound, and further has satisfactory moisture resistance reliability and moldability, and a semiconductor device using such a composition. <P>SOLUTION: The sealing resin composition includes (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a polyhydric alcohol type non-ionic dispersant, (D) aluminum hydroxide, and (E) an inorganic filler except aluminum hydroxide as essential components, and is free from halogen-based and antimony-based flame retardants. The semiconductor device includes a semiconductor element sealed by a cured product of such a component. <P>COPYRIGHT: (C)2013,JPO&INPIT |
